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MX530VX Industrial WiFi 5 Module
MX530VX Industrial WiFi 5 Module
Category: Industrial WiFi Modules
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MAXON MX530VX is a high-performance industrial WiFi 5 Mini PCIe module powered by Qualcomm® QCA9880/QCA9882 chipsets, delivering enhanced wireless performance for demanding embedded networking applications. Based on IEEE 802.11ac technology, this module features 3×3 MIMO technology to provide higher throughput, improved coverage, and greater wireless capacity.
Designed for OEM integration into industrial computers, gateways, wireless networking equipment, and embedded systems, the MX530VX is optimized for high-bandwidth applications requiring stable and reliable connectivity. With advanced MIMO capability and industrial-grade design, it is ideal for wireless networking equipment, video surveillance systems, industrial gateways, and IoT applications.
Key Features
- Qualcomm® QCA9880/QCA9882 chipset based high-performance WiFi module
- IEEE 802.11ac WiFi 5 dual-band connectivity
- 3×3 MIMO technology for enhanced throughput and wireless capacity
- Mini PCI Express 1.1 interface for OEM integration
- Improved coverage and multi-device connectivity
- Stable RF performance for bandwidth-intensive applications
- Industrial-grade reliability for demanding environments
Applications
- Industrial wireless access points
- High-performance wireless gateways
- Video surveillance systems
- Industrial networking equipment
- Smart manufacturing systems
- Robotics and automation platforms
- IoT edge devices
Specifications
| Chipset | Qualcomm QCA9880/QCA9882 |
| Reference Design | XB140-020 |
| Host Interface | Mini PCI Express 1.1 Standard |
| Operating Voltage | 3.3V DC |
| Antenna Connector | 3x U. FL |
| Frequency Range | 2.4GHz: 2.412GHz to 2.472GHz, or 5GHz: 5.150GHz to 5.825GHz,selectable dual band |
| Certification | FCC & CE Certified, REACH & RoHS Compliance |
| Power Consumption | 5W (Max) |
| Supported Operating System | Qualcomm Atheros reference wireless drivers or OpenWRT/LEDE with ath10k wireless drivers, |
| Modulation Techniques | OFDM: BPSK, QPSK, DBPSK, DQPSK, 16-QAM, 64-QAM, 256-QAM |
| Environmental Temperature | Operating: -20°C to 70°C, Storage: -40°C to 90°C |
| Environmental Humidity, non-condensing | Operating: 5% to 95%, Storage: Max. 90% |
| ESD Sensitivity | Class 1C |
| Dimensions (W × H × D) | 30.0mm × 50.9mm × 3.2mm |
Connector Map
Mechanical Dimensions
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