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MX6974 F5 Qualcomm QCN9074 WIFI6 Module / 4x4 MIMO / PCI Express 3.0

MX6974 F5 Qualcomm QCN9074 WIFI6 Module / 4x4 MIMO / PCI Express 3.0


Category: Industrial WiFi Module Series


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Description

MX6974 F5 802.11ax Embedded Wireless modules that adopts M.2 E-key and supports PCI Express 3.0 protocol. It adopts Qualcomm® 802.11ax Wi-Fi technology, supports the 5180-5850GHz frequency band, has AP and STA functions with 4x4 MIMO and 4 spatial streams, suitable for applications of 5GHz IEEE802.11a/n/ac/ax. It is equipped with a dynamic frequency selection (DFS) function which has higher transmission efficiency than the previous generation.

Specifications

Type: Wireless Module

Chip: QCN9074

IEEE Standard: IEEE 802.11ax

Connector: PCI Express 3.0, M.2 E-key

Working voltage: 3.3V/5V

Frequency range: 5G:5.180GHz~5.850GHz

Modulation technology: 802.11n:OFDM(BPSK,QPSK,16-QAM,64-QAM,256-QAM)

802.11ac:OFDM(BPSK,QPSK,16-QAM,64-QAM,256-QAM)

802.11ax:OFDMA (BPSK,QPSK,DBPSK,DQPSK,16-QAM,64-QAM, 256-QAM,1024-QAM,4096-QAM)

Power (per chain): 802.11ax:Max. 21dBm

Power consumption: ≦15W

Receiving Sensitivity: 11ax:

HE20 MCS0 <-89dBm / MCS11 <-64dBm

HE40 MCS0 <-89dBm / MCS11 <-60dBm

HE80 MCS0 <-86dBm / MCS11 <-58dBm

Antenna Connector: 4 x U. FL

Operating Environment: Temperature: -20°C to 70°C/-4 ~ 158℉; Humidity: 95% (non-condensing)

Storage Environment: Temperature: -40°C to 90°C/-40 ~ 194℉; Humidity: 90% (non-condensing)

Certification: RoHS/REACH

Weight: 20g

Dimensions (W*H*D): 60 x 57 x 4.2 mm (±0.1mm)

Module Size

6974chicun

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